OZARK CIRCUITS
THERMAL MANAGEMENT
SOLUTIONS
Berquist and Thermogon material.
We can provide single sided and double sided boards with either of these materials.
In-house metal core product
Ozark has developed a composite material primarily for the mounting of high temp LED’s. While the material does not have the same heat transfer properties as the ceramic dielectrics, it has been tested and performs extremely well for this application. The bonding method we have developed for treating the Aluminum provides a extremely reliable adhesion to the dielectric layer. We presently have several customers who are using it in their designs for whom we are building production quantities.
TYPES OF METAL CORE PRODUCTS AVAILABLE
A. Single sided - These are composed of a copper circuit layer, a thin dielectric and a metal substrate. The substrate can be a variety of metals such as aluminum, copper, copper/invar/copper and copper/molybdenum/copper. The circuit layer is from 1 to 10 ounce copper. The dielectric is normally a high temperature epoxy but other resin systems may be used depending on dielectric requirements.
B. Double sided - This type of product consists of a thin double sided circuit board mounted to a metal substrate with a thin dielectric. In areas that have a LED or similar high temp operating component mounted on the board a pad located on both sides of the board under the component with a number of plated holes providing a thermal pad path to the metal substrate. For certain applications the holes can be filled with a conductive hole filler.
C. Multilayer up to 16 layers - This type of board is a standard multilayer board with a solid metal core located internally. Occasionally areas are milled in the surface so as to place a very hot component directly onto the metal substrate. Plated through holes connect the circuits on either side of the board while being electrically isolated from the metal core using a nonconductive filler in clearance holes in the core. When copper is the metal substrate plated holes can connect directly to the core if necessary.
D. Selective heat sinks - These are composed of a copper circuit layer, a thin dielectric and a copper metal substrate. The substrate has defined areas, located under selected components, which are a part of the copper core, but on the same level as the top circuit layer. The circuit layer is from 1 to 10 ounce copper. The dielectric is normally a high temperature epoxy but other resin systems may be used depending on dielectric requirements. The circuit portion can be single sided, double sided or multiplayer.
1. COST- Single Sided boards made with this product are approx. 20 to 30 percent below the cost of alternate ceramic based product. The Double Sided products made with this design are typically 50 percent or more below the cost of a ceramic product.
2. ASSEMBLY - Soldering is much simpler as the material is not as great of a heat sink. This is very critical during the assembly of boards for LED applications due to the problem of the LED’s being damaged using too much heat at the soldering stage.
3. LEAD TIMES - Since the material is fabricated in-house we can offer very quick turn around on engineering, prototype and small scale production orders.